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Application Note
Package Info
Package Outline
1.Bending Terminal Leads
 
    When bending the leads, in order to avoid excessive force in the area where the leads enter the plastic body,
use a tool clamps the point between the package and the bending point. Improper bending will damage the die,
resulting in a degradation in electrical characteristics or a reliability problem such as poor resistance to moisture.
There are some rules for the lead bending:
 
 1. The leads should be securely clamped between the bending point and the plastic body. The recommended
      minimum distance is shown as below:
      X = 2 mm for DO-41, DO-15, Case.
      X = 3 mm for DO-201AD Case.
      X = 4 mm for R-6 Case.

 2. Do not clamp on the plastic body, the forming tool should not damage the leads or the plastic body.
 3. The leads must be bent only once and they should not be bent at an angle of more than 90℃
 4. Leads must be formed before fixing them to a PCB or to a heatsink.
 
2.Mounting to Heatsink
 
  The mounting surface of a heatsink should be free from foreign materials and metallic filings, and have enough
flatness and finish comparable to that of back of diode package. Don't screw up the unit from backside ( heat sink )
and screwing up the unit from the front side (with marking). Be sure, when mounting devices to a heatsink,
that excessive torque may cause a mechanical failure of the device or a reliability problem.
( ex. electrical degrade.....). Also note, insufficient torque results in poorer heat transmission.
 
Recommended mounting hole, screw and mounting torque corresponding to our package are shown in Table.
Package Mounting hole ( Ø = mm ) Screw Torque  ( lb-in / Kg-cm )
TO-220 3.8 M3 4.5 / 5.1
ITO-220 3.2
TO-247 / S 3.8
 
        Thermal compounds ( greases ) facilitate interface thermal conduction between device and heatsink.
    Recommended compounds are hydrophilic oil based. When applied, compounds should be spread evenly
    in a very thin layer over the whole contact area.
 
       The contact thermal resistance Rthj-c in our datasheet are defined with the recommended mounting torque
   and with the thermal compound.
 

3.Soldering of Through-hole Mounting Device                                                  
                                                       
    Resistance to soldering heat test is carried out under the condition shown below. Soldering should be                                                   
completed at a lowest possible temperature for a shortest period.                                                    
                                                       
  Temp. =   260 ℃(max)                                        
  Duration =       10 sec (max)                                          
                                                       
  Fig.-02 Shows the Dip duration vs. Solder Temperature Rating for plastic diodes.                                                      
                                                       
  General requirements for manual soldering are as follows:                                                
   1. Use a soldering iron for 40 watts maximum, that is grounded or with a high insulation resistance.                                                     
   2. The iron tip is kept away from any plastic body.                                                       
   3. Attachment should be achieved in not more than 3 seconds.                                                                                                          
   
   Be sure again not to put an excessive mechanical stress on device, as a rough insertion of device into                                                  
a through-hole, or manual reforming of leads after soldering.
Fig.-02 Rated Duration of Immersion vs. Soldering Temperature

 

4. Suggested thermal profiles for soldering process

  4.1.Reflow profiles of surface-mount device

 Reflow Profiles in tabular form

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate( Tsmax to Tp ) 3 ℃ / sec Max. 3 ℃ / sec Max.
Preheat    
Temperature Min ( Tsmin ) 100 ℃ 150 ℃
Temperature Min ( Tsmax ) 150 ℃ 200 ℃
Time ( Tsmin to Tsmax ) ( ts ) 60 ~ 120 sec 60 ~ 180 sec
Time maintained above    
Temperature ( TL ) 183 ℃ 217 ℃
Time ( tL ) 60 ~ 150 sec 60 ~ 150 sec
Peak Temperature ( Tp ) 255 ℃ -0/+5 ℃ 255 ℃ -0/+5 ℃
Time within 5℃ of actual Peak
Temperature ( tp )
10 ~ 30 sec 20 ~ 40 sec
Ramp - down Rate 6 ℃ / sec Max. 6 ℃ / sec Max.
Time 25 ℃ to Peak Temperature 6 minutes Max. 6 minutes Max.
 
   Note 1: All temperatures refer to topside of the package, measured on the package body surface.
   Note 2: Time within 5 ℃ of actual peak temperature ( tp ) specified for the reflow profiles is a " user " maximum.
 
 4.2.Wave profiles of DIP device

Wave Profiles in tabular form

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate ~ 200 ℃ / sec ~ 200 ℃ / sec
Heating rate during preheat Typ. 1 ~ 2, Max 4℃ / sec Typ. 1 ~ 2, Max 4℃ / sec
Final preheat temperature   Within 125℃ of solder temp. Within 125℃ of solder temp.
Peak Temperature 235℃ 260℃
Time within +0 / -5 ℃ of actual peak 10 sec 10 sec
Ramp-Down rate 5 ℃ / sec   Max. 5 ℃ / sec   Max.

5. Recommanded Warehouse Storage conditions:

     Ensure that electrical product may be stored for extended periods before use, we recommend that warehouse storage condition as:

       Temperature = 5℃ ~ 30℃
       Humidity = 45 ± 25%